Estamp Slovakia’s Maintenance Group Leader and Manufacturing Engineering Manager at the 25th Edition of the International Engineering Fair 2018
Last 24 May 2018, Estamp attended the 25th edition of the International Engineering Trade Fair of machinery, tools, equipment and technologies. The event lasted four days and was held from 22 to 25 May 2018 at the Agrokomplex in Nitra, Slovakia.
The fair is a meeting point for many national and international exhibitors and gives them the opportunity to present their latest machinery, tools, equipment and technologies, in addition to providing information on innovations and new trends in the automotive industry.
Estamp contributes to the success of its clients by providing new thermal and thermo-acoustic insulation solutions. We strive every day to redefine ourselves and keep abreast of the latest automotive market trends, to help OEMs become successful global brands.
We are extremely satisfied with our visit to the fair, where we made new contacts and shared experience with other professionals from our market in addition to identifying potential suppliers and above all, new technologies that give added value to Estamp.
